This Solicitation opportunity from Department Of Defense was posted on August 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Call For Solutions: Circuit Card Assembly (CCA) Production Support and Scalability Solutions

Closed

CCA_26_01Federal

Submission Closed08/10/2026, 06:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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1 day ago

DEADLINE

in 10 days

AI Contract Overview

The Army Contracting Command–Aberdeen Proving Ground, Tobyhanna Division, on behalf of Tobyhanna Army Depot, is issuing a Call for Solutions to identify innovative commercial methodologies, processes, and technologies that can rapidly scale Circuit Card Assembly production using existing Surface Mount Technology and through-hole component machinery. The initiative aims to close internal capability gaps by advancing design approaches, reverse engineering techniques, obsolescence management strategies, and supply chain resilience efforts to accelerate the development of essential CCA manufacturing data. Proposals must address scalable solutions that enhance production efficiency and responsiveness without requiring full-scale infrastructure overhauls. Responses must reference the solicitation number CCA_26_01 in the email subject line and adhere to submission guidelines outlined in the accompanying Call for Solutions document available in the attachments section. The solicitation is open through August 10, 2026, with questions and answers published as of July 28, 2026. The primary point of contact is Dean Berkovics, reachable via email and phone, and the place of performance is Tobyhanna, Pennsylvania. The North American Industry Classification System code associated with this effort is 334418, indicating an electronic component manufacturing context. While no contract value, evaluation criteria, delivery schedules, or detailed technical specifications are provided in the available documentation, respondents are directed to review the associated Army Open Solicitation on SAM.gov for complete structural context. All submissions must be submitted through the established channel, and no contract clauses, representations, certifications, packaging requirements, or administration data are included in the current documentation, leaving the full scope of obligations to be determined through the submission process and any attached materials referenced in the Call for Solutions.

General Info

Army seeks innovative CCA manufacturing solutions to improve efficiency, scalability, and supply chain resilience using existing equipment.

Agency

Department Of Defense → W6QK Acc-Apg Cont Ct Tyad OfcView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Tobyhanna, PA, 18466, USA

Set-Aside

NONE

Documents

(3)

Call for Solutions: Innovative Circuit Card Assembly Production Support - W9128Z-25-S-A002

PDF•call-for-solutions

Questions and Answers 1 Circuit Card Assembly

PDF•q-and-a

Questions and Answers 2 Circuit Card Assembly

PDF•q-and-a

AI Contract Breakdown

Uniform Contract Format

Timeline

2 updates

PhaseClosed

PostedJul 10

Solicitation

Amendment 1Jul 28

Contract was updated

Amendment 2Aug 5

Contract was updated

Response DeadlineAug 10

Deadline has passed

Submission Closed

08/10/2026, 06:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → W6QK Acc-Apg Cont Ct Tyad Ofc

Contacts1 person available

OfficeTOBYHANNA, PA, 18466-0000, USA

Organization / Agency

Department Of Defense → W6QK Acc-Apg Cont Ct Tyad Ofc

View Agency Profile

Office AddressTOBYHANNA, PA, 18466-0000, USA

Contacts

Dean Berkovics

contact@example.gov

+1 (555) 000-0000

Full Description

The Army Contracting Command- Aberdeen Proving Ground (ACC-APG), Tobyhanna Division on behalf of Tobyhanna Army Depot (TYAD) is seeking innovative solutions Circuit Card Assembly (CCA) Production Support and Scalability Solutions.

TYAD seeks innovative commercial methodologies, processes, and technologies to rapidly scale Circuit Card Assembly (CCA) production using our existing Surface Mount Technology (SMT) automated lines and through-hole component machinery. We are soliciting novel approaches to design, reverse engineering, obsolescence management, and supply chain resilience that will close internal capability gaps and accelerate timelines for building essential CCA manufacturing data.

The Call for Solutions document (.pdf), outlining the full problem statement, required solution attributes, submission requirements, and evaluation phases can be found in the "Attachments" section below.

The following shall be utilized in the email subject line: "Call for Solution-CCA_26_01"

The Army Open Solicitation (AOS) that this Call for Solution is associated with can be found at: https://sam.gov/workspace/contract/opp/a827ea963c6c4344b3494ad83a08d25c/view

Please review the AOS posting and associated attachments, in addition to the attachment for this call, for further information on how the AOS is structured.

7/28/2026: Questions and Answers 1 Posted

8/5/2026: Questions and Answers 2 Posted