Call For Solutions: Circuit Card Assembly (CCA) Production Support and Scalability Solutions
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The Army Contracting Command–Aberdeen Proving Ground, Tobyhanna Division, is seeking innovative commercial solutions to enhance and scale Circuit Card Assembly production at Tobyhanna Army Depot using existing Surface Mount Technology and through-hole component equipment. The focus is on novel methodologies that address critical gaps in design, reverse engineering, obsolescence management, and supply chain resilience to accelerate the development of essential manufacturing data and reduce production timelines. Proposals must demonstrate scalable approaches that leverage current infrastructure while introducing new processes or technologies capable of improving efficiency and throughput in CCA manufacturing. Solicitation CCA_26_01 is open for submissions until August 10, 2026, with responses required to include the correct subject line and align with the Army Open Solicitation framework detailed on SAM.gov. The NAICS code is 334418, and all correspondence must be directed to Dean Berkovics at the provided email and phone number. Proposals will be evaluated based on the criteria outlined in the Call for Solutions document, which is accessible through the attachments linked in the solicitation. Responses must be submitted via the official SAM.gov portal, and interested parties are encouraged to review both the AOS posting and the specific attachment for full requirements and evaluation phases.
General Info
Agency
NAICS
Place of Performance
Tobyhanna, PA, 18466, USASet-Aside
Timeline
Response Deadline
Organization & Contact Information
Full Description
The Army Contracting Command- Aberdeen Proving Ground (ACC-APG), Tobyhanna Division on behalf of Tobyhanna Army Depot (TYAD) is seeking innovative solutions Circuit Card Assembly (CCA) Production Support and Scalability Solutions.
TYAD seeks innovative commercial methodologies, processes, and technologies to rapidly scale Circuit Card Assembly (CCA) production using our existing Surface Mount Technology (SMT) automated lines and through-hole component machinery. We are soliciting novel approaches to design, reverse engineering, obsolescence management, and supply chain resilience that will close internal capability gaps and accelerate timelines for building essential CCA manufacturing data.
The Call for Solutions document (.pdf), outlining the full problem statement, required solution attributes, submission requirements, and evaluation phases can be found in the "Attachments" section below.
The following shall be utilized in the email subject line: "Call for Solution-CCA_26_01"
The Army Open Solicitation (AOS) that this Call for Solution is associated with can be found at: https://sam.gov/workspace/contract/opp/a827ea963c6c4344b3494ad83a08d25c/view
Please review the AOS posting and associated attachments, in addition to the attachment for this call, for further information on how the AOS is structured.
