Circuit Card Assembly (CCA) Manufacturing
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The contract pertains to the full-scale manufacturing of circuit card assemblies under a subcontract arrangement managed by the Defense Logistics Agency under the Department of Defense. The work encompasses all stages of production including component sourcing, printed circuit board fabrication, surface mount and through-hole assembly, and final assembly operations. The North American Industry Classification System code 334418 indicates that this activity falls within the category of other electronic component manufacturing. The contract was posted on July 14, 2026, and the place of performance and specific location details are not provided, indicating potential flexibility in where the manufacturing will be executed. There is no set-aside designation specified, meaning the contract is open to all eligible contractors without restrictions based on small business or other categories. The official record can be accessed through the DIBBS system using the provided contract identifier.
General Info
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Place of Performance
Not specifiedSet-Aside
Documents
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