Circuit Card Assembly (CCA) Manufacturing and Testing
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The contract involves the full lifecycle production of 23 to 46 military-grade Circuit Card Assemblies identified by NSN 5998-01-659-7676 and MPN 407919-006, encompassing all stages from fabrication and component assembly to functional testing and final delivery. These units are destined for integration into the Next Generation Automated Test System, requiring strict adherence to military specifications and quality standards to ensure operational readiness and reliability in defense applications. The work must be completed to meet stringent performance criteria, with rigorous testing protocols to validate functionality under operational conditions. This is a subcontract under the Department of Defense, managed by DLA Land Warren, with the North American Industry Classification System code 334418 indicating electronics manufacturing services. The contract was posted on July 2, 2026, and performance is expected to support critical defense infrastructure without specified geographical limitations on the place of performance. All deliverables must be fully compliant with defense requirements, and the subcontractor is responsible for end-to-end accountability including documentation, traceability, and timely delivery to enable seamless system integration.
General Info
Agency
NAICS
Place of Performance
MI, USASet-Aside
Documents
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