High-Reliability PCB Fabrication for Defense Systems

The contract seeks the fabrication of high-reliability multilayer printed circuit boards with strict impedance control, utilizing military-grade materials including polyimide or high-Tg FR4, specifically for integration into DC/DC SRU assemblies within defense systems. The work must meet rigorous environmental and performance standards expected in military applications, ensuring long-term durability, thermal stability, and signal integrity under demanding operational conditions. Fabrication processes must adhere to stringent quality control protocols consistent with defense industry requirements and include full traceability of materials and manufacturing steps. This subcontract opportunity is issued by the Naval Surface Warfare Center Crane Division under the Department of Defense, with a response deadline of June 26, 2026, at 6:00 PM. The place of performance is designated as Crane, Indiana, with the NAICS code 334419 indicating the focus on electronic component and product manufacturing. The solicitation is open to qualified subcontractors capable of delivering production-grade PCBs that comply with military specifications, and interested parties must submit proposals prior to the deadline to be considered for award.