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Integrated Multicomponent Module for Quantum Sensors

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OSW26BZ04-DV007SBIR / STTR

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The Department of Defense seeks to advance quantum sensing through the development of integrated, commercial off-the-shelf components that reduce size, weight, and power while enhancing performance and affordability. The goal is to move beyond custom, discrete hardware by creating modular, interoperable components that can be reused across multiple quantum sensor designs, accelerating deployment and lowering costs. Emphasis is placed on technologies such as photonic integrated circuits, microcells, and solid-state platforms like color centers, silicon nitride, and thin film lithium niobate to enable compact, robust light sources, modulators, and isolators that minimize losses from internal interfaces. By integrating these elements onto a single substrate, the project aims to reduce form factor and improve reliability without sacrificing modularity, which is critical for broad industry adoption and innovation. The initiative is designed not only to serve defense applications but also to stimulate commercial markets by making quantum sensors more accessible to non-traditional vendors in microelectronics and manufacturing. This dual-use strategy encourages participation from small businesses with expertise in semiconductor fabrication and microsystem integration, leveraging existing industrial capabilities to scale quantum-enabled technologies. The solicitation is a total small business set-aside under the SBIR/STTR mandate, focusing on firms under 500 employees, and targets the development of standardized, high-performance components that can serve as foundational building blocks for the broader quantum ecosystem. Success will be measured by the ability of the resulting modules to lower SWaP benchmarks while enabling future standardization of quantum support devices and expanding market reach beyond government use.

General Info

Develop compact, modular quantum sensor components using commercial tech to reduce size, weight, power, and cost for defense and commercial use.

Agency

Department of Defense → Office of the Secretary of DefenseView Agency

NAICS

334513 - Instruments and Related Products Manufacturing for Measuring, Displaying, and Controlling Industrial Process Variables View NAICS

Place of Performance

Not specified

Set-Aside

SBA

Documents

(0)

No documents available

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Timeline

PhaseSolicitation
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Organization & Contact Information

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AgencyDepartment of Defense → Office of the Secretary of Defense
ContactsNo contacts available
OfficeUS
Organization / Agency
Department of Defense → Office of the Secretary of Defense
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Office AddressUS
ContactsNo contact information available

Full Description

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The DoW needs quantum sensing capabilities that are Size, Weight, and Power (SWaP) compatible with a broad range of vehicles and platforms, and it seeks to develop commercial, off-the-shelf (COTS) components with integrated capabilities that currently hinder low-SWAP quantum sensors. Such COTS components could provide multiple advantages: § Integrating capability for use in different sensor designs across the quantum industry § Accelerating the development of low SWaP, low-cost quantum sensors by focusing resources on COTS solutions that currently hinder such development from custom, discrete approaches § Expanding dual-use market opportunities through commercial application of such COTS components individually and by enabling quantum sensors with more attractive price points for commercial markets § Providing initial steps needed for eventual standardization of quantum technologies and quantum support devices targeting the most mature quantum technology currently available, i.e., quantum sensors § Attracting non-quantum commercial companies to leverage their expertise in microelectronic device manufacturing Proposed approaches should target capabilities needed for supporting quantum device operation broadly needed in the quantum sensor community with the result of lowering overall SWaP and cost of such sensors. They should carefully consider the expected market potential for selling the resulting component to the quantum community and potentially beyond to non-quantum DoW and commercial markets. The mix of component technologies that enable quantum devices should account for such market potential and be key elements in reducing the SWAP of overall quantum sensors. Proposed solutions could leverage, but they are not limited to, photonic integrated circuits (PICs), microcells, and solid-state technologies like color centers, silicon nitride (SiN), and thin film lithium niobate (TFLN) to enable the production of compact and robust light sources, isolators, modulators, and other components used to realize quantum sensing, computing, and networking capabilities. These components are still largely produced in isolation, incurring performance losses due to interfacing issues such as fiber insertion loss or reflection at waveguide facets. Directly integrating these components onto (e.g.) a single substrate can reduce the losses resulting from internal interfaces and enable reduced form-factors, but they must balance a need for the modularity that enables reuse and accelerates innovation.

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