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This Government Contract opportunity from Department Of Defense was posted on July 15, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

MEMS and Photonics Device Fabrication

Closed
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418
New
DIBBS
ELECTRONIC MODULE, STAN
Solicitation # SPE7M5-27-T-0997
Solicitation SPE7M5-27-T-0997, issued by the DLA Weapons Support Active Devices Division, is a request for quotations for one standardized electronic module, NSN 5963013531602. The requirement specifies that the item must meet the degree of interchangeability defined in MIL-STD-280A PARA.3.2.1.ALT and requires the bidder to provide a Certificate of Compliance and supporting data. The manufacturer's inspection system must comply with SAE AS9003 or ISO 9001 tailored to SAE AS9003, with sampling conducted per MIL-STD-1916, ASQ H1331, or a comparable zero-based sampling plan. Delivery is required within 20 days to the USS SEAWOLF SSN 21 via the fastest traceable means, with inspection and acceptance occurring at the destination. The contract mandates strict adherence to environmental and safety standards, including a prohibition on Class I ozone-depleting substances and the intentional addition of mercury. Rigorous packaging requirements are in place to prevent damage to leads and terminals, specifically requiring DOD qualified Electrostatic Discharge and Electromagnetic Interference protective materials per MIL-PRF-81705 and marking in accordance with MIL-STD-129. Administrative requirements include CMMC Level 2 Self-Assessment, Buy American Act compliance, and the use of the Wide Area Workflow system for invoicing. Offers involving additive manufacturing are ineligible for award.
DLA WEAPONS SUPPORT ACTIVE DEVICES DIVISION

POSTED

about 18 hours ago

DEADLINE

in 2 days

AI Contract Overview

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The contract involves the fabrication of high-Q MEMS and photonic devices designed to operate in isolated environments, requiring advanced processes such as lithography, etching, and precise testing of resonators and waveguides. The work focuses on developing devices with exceptional quality factors and stable performance under controlled conditions, essential for high-sensitivity applications in defense and advanced sensing technologies. All phases of manufacturing from design to validation must meet stringent technical standards to ensure reliability and reproducibility. This is a subcontract opportunity issued by the Defense Advanced Research Projects Agency under the Department of Defense, with a NAICS code of 334418 indicating specialization in semiconductor and related electronic component manufacturing. The solicitation was posted on July 15, 2026, and responses are due by September 23, 2026. The place of performance and specific location details are not specified, and no set-aside preferences are indicated, making it open to qualified subcontractors regardless of size or status. All work must be completed in alignment with the agency’s technical and contractual requirements for defense-critical photonic and microelectromechanical systems.

General Info

Fabricate high-Q MEMS and photonic devices for defense sensing under stringent technical standards.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

VA

Set-Aside

NONE

Documents

This scope was carved out of DARPA-PS-26-127.

The full solicitation package (34 documents), including the RFP, is on the prime solicitation, not on this scope.

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Advanced Research Projects Agcy
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Fabrication of high-Q MEMS and photonic devices operating in isolated environments, including lithography, etching, and testing of resonators and waveguides.

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