MEMS and Photonics Device Fabrication

The contract involves the fabrication of high-Q MEMS and photonic devices designed to operate in isolated environments, requiring advanced processes such as lithography, etching, and precise testing of resonators and waveguides. The work focuses on developing devices with exceptional quality factors and stable performance under controlled conditions, essential for high-sensitivity applications in defense and advanced sensing technologies. All phases of manufacturing from design to validation must meet stringent technical standards to ensure reliability and reproducibility. This is a subcontract opportunity issued by the Defense Advanced Research Projects Agency under the Department of Defense, with a NAICS code of 334418 indicating specialization in semiconductor and related electronic component manufacturing. The solicitation was posted on July 15, 2026, and responses are due by September 23, 2026. The place of performance and specific location details are not specified, and no set-aside preferences are indicated, making it open to qualified subcontractors regardless of size or status. All work must be completed in alignment with the agency’s technical and contractual requirements for defense-critical photonic and microelectromechanical systems.