Microscale Ultra-High-Vacuum (µUHV) Systems Development

The contract seeks the design and fabrication of microscale ultra-high-vacuum systems tailored for high-performance MEMS and photonic devices, requiring the development of miniaturized chambers and hermetic packaging capable of maintaining extreme vacuum conditions at microscopic scales. The work involves advanced engineering to meet stringent performance criteria for vacuum integrity, thermal stability, and material compatibility, ensuring reliable operation of sensitive microscale components in demanding environments. The project is structured as a subcontract under the Department of Defense, specifically managed by the Defense Advanced Research Projects Agency, with a focus on enabling next-generation microsystems for defense and aerospace applications. Proposals must be submitted by September 23, 2026, following a posting date of July 15, 2026, and the work falls under NAICS code 334516 for other semiconductor and related device manufacturing. The place of performance and detailed contact information are not specified, but the technical scope emphasizes innovation in packaging and vacuum system miniaturization without reliance on macro-scale solutions. This effort is critical for advancing the capabilities of embedded photonic and microelectromechanical systems that require stable, long-term vacuum environments to ensure functionality and durability in field-deployable platforms.