MIL-STD-2073-1E Compliant Packaging
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The contract specifies the packaging of microcircuits in strict compliance with MIL-STD-2073-1E standards, requiring the use of ESD-protective materials including MIL-PRF-81705 barrier films and A-A-59136 cushioning to ensure defense-grade protection against electrostatic discharge and physical damage. All packaging must include proper container coding and lead immobilization techniques to prevent movement and potential damage during handling and transit. The work is to be performed at a designated location in Columbus, Ohio, with a zip code of 43213, under the oversight of the Active Devices Division within the Department of Defense. This subcontract is classified under NAICS code 423830 and is open for responses until August 13, 2026, with the solicitation posted on August 2, 2026. The procurement is managed through the DIBBS system with a public link for access and submission.
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COLUMBUS, OH, 43213, USSet-Aside
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