This Government Contract opportunity from Department Of Defense was posted on May 7, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
MIL-STD-2073 Packaging and Preservation
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract entails packaging and preservation of Circuit Card Assemblies (CCA) in compliance with MIL-STD-2073 standards. This includes the use of moisture barrier bags, desiccants, and corrosion prevention measures to ensure product integrity during storage and transport. Additionally, the contract requires thorough documentation, specifically the preparation and submission of DD Form 250 and WAWF Receiving Reports to accurately track and verify deliveries. Issued by the Department of Defense through the SPRMM1 DLA Mechanicsburg office, the subcontract aligns with NAICS code 385990, indicating its focus on packaging activities. The solicitation was posted on May 7, 2026, with a response deadline on June 8, 2026. While location details and specific points of contact are not provided, the contract is intended to uphold stringent military packaging requirements to safeguard sensitive electronic components within defense supply chains.
General Info
Agency
NAICS
Place of Performance
PA, USASet-Aside
Documents
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Timeline
Submission Closed
