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Multichip Module Package for SiC Pressure Sensors

Active

80NSSC26936730QFederal

Response Deadline06/30/2026, 12:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

General Info

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

334419 - Other Electronic Component Manufacturing View NAICS

Place of Performance

Cleveland, OH, 44135, USA

Set-Aside

NONE

Documents

(3)

NASA NSSC Sole Source Capability Statement for Multichip Module Package

PDF•sources-sought

Modification of Statement of Work for Multi-Chip Packaging of SiC Sensors

PDF•modification

NASA Sole Source Justification for SiC Pressure Sensor MCM Package

PDF•justification-and-authorization

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Timeline

PhaseCombined Synopsis

PostedJun 26

Combined Synopsis

Response DeadlineJun 30

Submission deadline

Response Deadline

06/30/2026, 12:00:00 PM UTCin 3 days

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Organization & Contact Information

AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

Contacts1 person available

OfficeSTENNIS SPACE CENTER, MS, 39529, USA

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

View Agency Profile

Office AddressSTENNIS SPACE CENTER, MS, 39529, USA

Contacts

Shanna Patterson

contact@example.gov

Full Description

** THIS IS A SOLE SOURCE REQUIREMENT ** for Multichip Module Package for SiC Pressure Sensors

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