Multichip Module Package for SiC Pressure Sensors

This is a sole source procurement under FAR 12.102(a) for a Multichip Module Package designed for silicon carbide (SiC) high-temperature pressure and temperature sensors, intended exclusively for Sienna Technologies, Inc. The contract, issued by the NASA Shared Services Center on behalf of the National Aeronautics and Space Administration, requires the fabrication of a specialized package incorporating government-furnished SiC sensors onto a custom aluminum nitride (AlN) circuit board, with strict thermal expansion matching of no more than 4 ppm/°C to ensure compatibility with the SiC sensors. The deliverables include a hermetically brazed AlN receptacle designed to withstand temperatures up to 700°C and securely attached Au-plated nickel pins in blind holes, all assembled per government-provided drawings and export-controlled technical data. Performance is to occur at NASA Glenn Research Center in Cleveland, Ohio, with delivery required no later than December 31, 2026, to the specified facility at 21000 Brookpark Road, Mail Stop 77-2. The acquisition is classified as a commercial item procurement under FAR Part 12, with NAICS code 334419, and is subject to NASA’s FAR Supplement Clause 1852.215-84, Ombudsman. All proposals must be submitted in writing by 7:00 a.m. Central Standard Time on June 30, 2026, to Shanna L. Patterson, and oral communications are prohibited. While the total contract value is not specified, the technical requirements are precisely defined to support extreme-environment applications, and compliance with export control regulations is mandatory. No competitive evaluation factors are applicable due to the sole source nature of this solicitation.