This Government Contract opportunity from National Aeronautics And Space Administration was posted on May 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Precision PCB Assembly (Surface Mount & Through-Hole)

Closed

Federal

Submission Closed06/03/2026, 09:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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ELECTRICAL DEVICES DIV

POSTED

about 16 hours ago

DEADLINE

in 9 days

AI Contract Overview

This contract involves the complete assembly of high-reliability 12-layer radio frequency printed circuit boards, requiring expertise in both surface mount technology (SMT) and through-hole component placement. The scope includes precise soldering, thorough automated optical inspection (AOI) and X-ray evaluation to ensure quality, along with rigorous functional testing. All processes must be conducted within an electrostatic discharge (ESD) safe environment to maintain component integrity. The opportunity is a total small business set-aside under the SBA, designated under NAICS code 334419 and is issued by the NASA Shared Services Center. The work is to be performed in Cleveland, Ohio, with a response deadline of June 3, 2026. This subcontract aims to support NASA’s high standards for electronic assembly in advanced aerospace applications by leveraging specialized capabilities in producing complex, multi-layer RF PCBs.

General Info

Assembly of 12-layer RF PCBs with SMT, X-ray, AOI, testing, ESD-safe; NASA small business set-aside.

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

334419 - Other Electronic Component ManufacturingView NAICS

Place of Performance

Cleveland, OH, 44135, USA

Set-Aside

SBA

Documents

This scope was carved out of 80NSSC26933620Q.

The full solicitation package (7 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

ADaPT Gen III PCB Fabrication/Assembly

AI Contract Breakdown

Uniform Contract Format

No contract breakdown available.

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Timeline

PhaseClosed

PostedMay 28

subcontract

Response DeadlineJun 3

Deadline has passed

Submission Closed

06/03/2026, 09:00:00 PM UTC

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Organization & Contact Information

AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

Complete assembly of high-reliability 12-layer RF PCBs including SMT and through-hole component placement, soldering, AOI/X-ray inspection, and functional testing in an ESD-safe environment.