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This Government Contract opportunity from National Aeronautics And Space Administration was posted on May 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Precision PCB Assembly (Surface Mount & Through-Hole)

Closed
Federal

Contract Overview

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This contract involves the complete assembly of high-reliability 12-layer radio frequency printed circuit boards, requiring expertise in both surface mount technology (SMT) and through-hole component placement. The scope includes precise soldering, thorough automated optical inspection (AOI) and X-ray evaluation to ensure quality, along with rigorous functional testing. All processes must be conducted within an electrostatic discharge (ESD) safe environment to maintain component integrity. The opportunity is a total small business set-aside under the SBA, designated under NAICS code 334419 and is issued by the NASA Shared Services Center. The work is to be performed in Cleveland, Ohio, with a response deadline of June 3, 2026. This subcontract aims to support NASA’s high standards for electronic assembly in advanced aerospace applications by leveraging specialized capabilities in producing complex, multi-layer RF PCBs.

General Info

Assembly of 12-layer RF PCBs with SMT, X-ray, AOI, testing, ESD-safe; NASA small business set-aside.

Agency

National Aeronautics And Space Administration → NASA Shared Services Center

NAICS

334419 - Other Electronic Component Manufacturing View NAICS

Place of Performance

Cleveland, OH, 44135, USA

Set-Aside

SBA

Documents

(0)

No documents available

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyNational Aeronautics And Space Administration → NASA Shared Services Center
ContactsNo contacts available
OfficeN/A
Organization / Agency
National Aeronautics And Space Administration → NASA Shared Services Center
Office AddressN/A
ContactsNo contact information available

Full Description

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Complete assembly of high-reliability 12-layer RF PCBs including SMT and through-hole component placement, soldering, AOI/X-ray inspection, and functional testing in an ESD-safe environment.