Rigid-Flex Printed Circuit Board (PCB) Manufacturing

This contract involves the manufacturing of 400 CAPRE NIM I/O Boards utilizing rigid-flex printed circuit board technology, specifically designed for high-reliability defense applications. The scope encompasses all stages of production, including fabrication, lamination, drilling, plating, and final assembly, ensuring the delivered boards meet stringent quality and performance standards required by the Department of Defense. The project emphasizes advanced manufacturing techniques to support critical defense systems, highlighting the importance of precision and durability in the final product. The contract is a subcontract awarded by the Defense Microelectronics Activity under the Department of Defense and is classified under the NAICS code 334418, which pertains to semiconductor and related device manufacturing. The place of performance is located in Linda, California, with the postal code 95652. The contract does not specify any particular set-aside requirements, and while the solicitation number is not provided, the contract posting date is June 4, 2026. This initiative reflects a strategic procurement effort to support defense electronics through specialized rigid-flex PCB technology.