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Rigid-Flex Printed Circuit Board (PCB) Manufacturing

Active

Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This contract involves the manufacturing of 400 CAPRE NIM I/O Boards utilizing rigid-flex printed circuit board technology, specifically designed for high-reliability defense applications. The scope encompasses all stages of production, including fabrication, lamination, drilling, plating, and final assembly, ensuring the delivered boards meet stringent quality and performance standards required by the Department of Defense. The project emphasizes advanced manufacturing techniques to support critical defense systems, highlighting the importance of precision and durability in the final product. The contract is a subcontract awarded by the Defense Microelectronics Activity under the Department of Defense and is classified under the NAICS code 334418, which pertains to semiconductor and related device manufacturing. The place of performance is located in Linda, California, with the postal code 95652. The contract does not specify any particular set-aside requirements, and while the solicitation number is not provided, the contract posting date is June 4, 2026. This initiative reflects a strategic procurement effort to support defense electronics through specialized rigid-flex PCB technology.

General Info

Manufacture 400 high-reliability CAPRE NIM I/O rigid-flex PCBs for DoD, Linda CA.

Agency

Department Of Defense → Defense Microelectronics ActivityView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

LINDA, CA, 95652, USA

Set-Aside

NONE

Documents

This scope was carved out of HQ072726FE068.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CAPRE NIM IO Boards

AI Contract Breakdown

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Timeline

PostedJun 4

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Microelectronics Activity

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Defense Microelectronics Activity

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Office AddressN/A

ContactsNo contact information available

Full Description

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Manufacture of 400 CAPRE NIM I/O Boards using rigid-flex PCB technology, including fabrication, lamination, drilling, plating, and final assembly for high-reliability defense applications.

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