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Specialized Semiconductor Manufacturing Equipment Supply

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Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This contract involves the procurement of specialized equipment for semiconductor, microcircuit, and printed circuit board fabrication processes, including systems for deposition, etching, lithography, and assembly. The requirement covers both commercially available off-the-shelf machinery and custom-built solutions tailored to advanced manufacturing needs in these high-technology fields. The contract is designated as a subcontract opportunity, specifically set aside entirely for small businesses under the Small Business Administration's Total Small Business Set-Aside program in accordance with FAR 19.5. The solicitation is issued by the Department of Defense’s Naval Surface Warfare Center Indian Head Division, with the place of performance located in Indian Head, Maryland (zip code 20640). The contract falls under the NAICS code 333342, which pertains to semiconductor machinery manufacturing. The response deadline for this opportunity is November 11, 2028, providing ample time for interested vendors to submit their proposals. This procurement aims to support critical defense-related manufacturing infrastructure through advanced and reliable equipment sourcing.

General Info

Procurement of semiconductor fabrication equipment for small businesses, Naval Surface Warfare Center, deadline 2028.

Agency

Department Of Defense → Nswc Indian Head DivisionView Agency

NAICS

Place of Performance

Indian Head, MD, 20640, USA

Set-Aside

SBA

Documents

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Organization & Contact Information

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AgencyDepartment Of Defense → Nswc Indian Head Division
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Nswc Indian Head Division
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ContactsNo contact information available

Full Description

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Supply of commercial off-the-shelf (COTS) or custom-built machinery for semiconductor, microcircuit, and PCB fabrication, including deposition, etching, lithography, and assembly systems.

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