Supply of Low-Temperature Anodic Bonding Glass Wafers

The contract involves the manufacture and supply of precision glass wafers designed for anodic bonding at temperatures below 250°C. These wafers must feature thermal expansion properties closely matched to silicon within ±20 ppm to ensure compatibility during bonding processes. Specifications include 4-inch diameter wafers that are 0.7 mm thick and polished to a high precision standard, suitable for advanced manufacturing applications. Issued by the Department of Commerce's National Institute of Standards and Technology (NIST), the subcontract seeks suppliers capable of meeting these stringent technical requirements. The work is to be performed in Boulder, with a response deadline set for June 1, 2026. The procurement falls under NAICS code 326199, indicating its association with the manufacturing of other plastics products, reflecting the specialized nature of the glass wafer fabrication. This opportunity is targeted towards vendors who can deliver high-quality, reliable materials critical for semiconductor and microelectronics applications.