3D PLUS U.S.A., INC.
3D PLUS U.S.A., INC. is a federal contractor, registered under UEI UQ4MVKPGKFK3 and CAGE code 3FBQ6. It has been awarded $16,306,833 across 123 federal contracts. Primary work spans Search, Detection, Navigation, Guidance, Aeronautical, and Nautical System and Instrument Manufacturing, Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology), and Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology). Top awarding agencies include Department Of Defense (dod), National Aeronautics And Space Administration (nasa), and National Aeronautics And Space Administration.
Contact Information
Registration and classification details
Registration
UEI Code
UQ4MVKPGKFK3CAGE Code
3FBQ6Entity Structure
Corporate Entity (Not Tax Exempt)Established
N/ABusiness Classifications
NAICS Codes
Federal Contracting Overview
Award totals, agency breakdown, NAICS distribution, and geographic footprint.
AI Capability Profile
3D PLUS U.S.A., INC. specializes in the design and manufacturing of high-reliability semiconductor devices, with demonstrated expertise in EEPROM memory chip production for mission-critical applications. The company’s technical capabilities center on non-volatile memory systems, including embedded f...
3D PLUS U.S.A., INC. specializes in the design and manufacturing of high-reliability semiconductor devices, with demonstrated expertise in EEPROM memory chip production for mission-critical applications. The company’s technical capabilities center on non-volatile memory systems, including embedded firmware integration, radiation-tolerant semiconductor fabrication, and precision chip-level testing protocols. Their work supports environments requiring long-term data retention, low-power operation, and resistance to extreme thermal and electromagnetic conditions—key attributes for aerospace and deep-space systems. The firm’s specialization in 8 MB EEPROM memory chips indicates a focus on compact, high-integrity storage solutions for avionics, spacecraft instrumentation, and onboard data logging systems, where failure tolerance is paramount. The contractor has delivered specialized semiconductor components to the National Aeronautics and Space Administration, suggesting a direct alignment with NASA’s needs for ruggedized, space-qualified electronics. This relationship points to a niche positioning within the space systems supply chain, where components must meet stringent MIL-STD and NASA-STD reliability standards. The work likely involves collaboration with NASA’s Goddard or Jet Propulsion Laboratory teams on payloads, sensors, or flight computers requiring deterministic memory performance under vacuum and radiation exposure. The primary NAICS code 334413 reflects core competency in semiconductor device manufacturing, specifically in memory and logic devices used in defense and space systems. The company’s market positioning is that of a specialized Tier 2 supplier, focused on high-assurance electronics rather than commercial-grade components. Their vertical specialization lies in aerospace and deep-space applications, where performance under extreme conditions defines success. As a small business structured as a 2L entity based in San Leandro, California, 3D PLUS U.S.A., INC. operates with a lean, technically focused team. While no formal government certifications are listed, their ability to secure a NASA award implies adherence to strict quality control, traceability, and documentation standards required for spaceflight hardware. Their geographic proximity to major aerospace hubs enhances their responsiveness to federal program timelines.
Key Performance Metrics
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