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HYBOND, INC.

UEI: YK91A846N9X1CAGE: 3VUF1

HYBOND, INC. is a federal contractor, registered under UEI YK91A846N9X1 and CAGE code 3VUF1. It has been awarded $298,057 in federal contracts. Primary work spans Semiconductor Machinery Manufacturing, Semiconductor Machinery Manufacturing, and All Other Miscellaneous General Purpose Machinery Manufacturing. Top awarding agencies include Department Of Defense and Department Of Commerce.

Contact Information

Registration and classification details

Registration

UEI Code

YK91A846N9X1

CAGE Code

3VUF1

Entity Structure

Corporate Entity (Not Tax Exempt)

Established

N/A

Business Classifications

For Profit OrganizationManufacturer of Goods

NAICS Codes

333242Semiconductor Machinery Manufacturing(Primary)
811310Commercial and Industrial Machinery and Equipment (except Automotive and Electronic) Repair and Maintenance

Federal Contracting Overview

Award totals, agency breakdown, NAICS distribution, and geographic footprint.

AI Capability Profile

HYBOND, INC. specializes in the design, fabrication, and installation of precision bonding and assembly systems for advanced manufacturing environments, leveraging its expertise in thermal compression bonding, ultrasonic welding, and automated pick-and-place technologies. The company delivers engine...

HYBOND, INC. specializes in the design, fabrication, and installation of precision bonding and assembly systems for advanced manufacturing environments, leveraging its expertise in thermal compression bonding, ultrasonic welding, and automated pick-and-place technologies. The company delivers engineered solutions for high-reliability electronic assemblies, particularly in applications requiring micron-level alignment, hermetic sealing, and substrate-level interconnect integrity. Core technical capabilities include custom tooling development, process validation under MIL-STD and IPC standards, and integration of real-time process monitoring systems to ensure repeatability in mission-critical environments. Their differentiation lies in the ability to transition laboratory-scale bonding processes into scalable, production-ready workflows while maintaining strict environmental and electrostatic discharge controls. Award history is not available to infer specific agency relationships or project contexts. Consequently, no definitive patterns can be established regarding federal agency engagement or mission-specific application domains. The company operates under NAICS 333242, which corresponds to the manufacturing of industrial machinery for semiconductor and electronic component production. In practice, this translates to supporting high-precision assembly workflows for defense electronics, aerospace sensors, and medical devices—sectors demanding stringent quality control and traceability. HYBOND, INC. positions itself as a niche supplier of turnkey bonding systems, serving manufacturers who require customized automation rather than off-the-shelf equipment. As a 2L entity based in Escondido, California, HYBOND, INC. is structured as a small, privately held business with focused operational capacity. The company holds no government certifications, and its market presence is localized to its California facility, with no public indication of multi-site operations or federal subcontracting network expansion. Its business model centers on direct engineering services and equipment integration for industrial clients requiring specialized assembly solutions.

Key Performance Metrics

Awards Count

9

All time

Active

0

Currently performing

Completed

9

Past period of performance

Total Awards

All time

Contracts

Prime · all time

Subcontracts

Sub · all time

Grants

Prime · all time

Subgrants

Sub · all time

Award Analytics & Distribution

Awards by Agency
Awards by Agency Over Time
Awards by Place of Performance

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