HYBOND, INC.
HYBOND, INC. is a federal contractor, registered under UEI YK91A846N9X1 and CAGE code 3VUF1. It has been awarded $298,057 in federal contracts. Primary work spans Semiconductor Machinery Manufacturing, Semiconductor Machinery Manufacturing, and All Other Miscellaneous General Purpose Machinery Manufacturing. Top awarding agencies include Department Of Defense and Department Of Commerce.
Contact Information
Registration and classification details
Registration
UEI Code
YK91A846N9X1CAGE Code
3VUF1Entity Structure
Corporate Entity (Not Tax Exempt)Established
N/ABusiness Classifications
NAICS Codes
Federal Contracting Overview
Award totals, agency breakdown, NAICS distribution, and geographic footprint.
AI Capability Profile
HYBOND, INC. specializes in the design, fabrication, and installation of precision bonding and assembly systems for advanced manufacturing environments, leveraging its expertise in thermal compression bonding, ultrasonic welding, and automated pick-and-place technologies. The company delivers engine...
HYBOND, INC. specializes in the design, fabrication, and installation of precision bonding and assembly systems for advanced manufacturing environments, leveraging its expertise in thermal compression bonding, ultrasonic welding, and automated pick-and-place technologies. The company delivers engineered solutions for high-reliability electronic assemblies, particularly in applications requiring micron-level alignment, hermetic sealing, and substrate-level interconnect integrity. Core technical capabilities include custom tooling development, process validation under MIL-STD and IPC standards, and integration of real-time process monitoring systems to ensure repeatability in mission-critical environments. Their differentiation lies in the ability to transition laboratory-scale bonding processes into scalable, production-ready workflows while maintaining strict environmental and electrostatic discharge controls. Award history is not available to infer specific agency relationships or project contexts. Consequently, no definitive patterns can be established regarding federal agency engagement or mission-specific application domains. The company operates under NAICS 333242, which corresponds to the manufacturing of industrial machinery for semiconductor and electronic component production. In practice, this translates to supporting high-precision assembly workflows for defense electronics, aerospace sensors, and medical devices—sectors demanding stringent quality control and traceability. HYBOND, INC. positions itself as a niche supplier of turnkey bonding systems, serving manufacturers who require customized automation rather than off-the-shelf equipment. As a 2L entity based in Escondido, California, HYBOND, INC. is structured as a small, privately held business with focused operational capacity. The company holds no government certifications, and its market presence is localized to its California facility, with no public indication of multi-site operations or federal subcontracting network expansion. Its business model centers on direct engineering services and equipment integration for industrial clients requiring specialized assembly solutions.
Key Performance Metrics
Awards Count
9
All time
Active
0
Currently performing
Completed
9
Past period of performance
Total Awards
All time
Contracts
Prime · all time
Subcontracts
Sub · all time
Grants
Prime · all time
Subgrants
Sub · all time
Award Analytics & Distribution
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