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200mm Prime Grade Wafer Fabrication

Active

Response Deadline09/24/2026, 04:29:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This small business set-aside subcontract with National Technology and Engineering Solutions of Sandia, LLC involves the fabrication of 200mm prime grade silicon wafers for Department of Energy NNSA projects. The scope of work includes slicing, polishing, and finishing, with a specific requirement for M12 backside lasermarking using precision systems. The contractor must adhere to strict technical specifications, including 100 percent TTV measurements with a 5um TTV, +/- 25um BOW, 35um WARP, and a maximum of 100 LLS per wafer at 0.12um. Additionally, the provider is required to maintain an ISO 9001 quality control program to ensure the delivery of high-quality finished wafers.

General Info

Subcontract for fabricating 200mm silicon wafers for DOE NNSA projects via ISO 9001.

Agency

National Technology and Engineering Solutions of Sandia, LLC (Sandia National Laboratories)View Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Not specified

Set-Aside

SBA

Documents

This scope was carved out of 3841.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Prime P and N Type Wafers

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Timeline

PostedSep 21

subcontract

Response DeadlineSep 24

Submission deadline

Response Deadline

09/24/2026, 04:29:00 PM UTCin about 8 hours

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Organization & Contact Information

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AgencyNational Technology and Engineering Solutions of Sandia, LLC (Sandia National Laboratories)

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Technology and Engineering Solutions of Sandia, LLC (Sandia National Laboratories)

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Office AddressN/A

ContactsNo contact information available

Full Description

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Performs slicing, polishing, and finishing of 200mm silicon wafers for prime contractors on Department of Energy NNSA projects. Executes 100% TTV measurements to specifications: TTV 5um, BOW +/- 25um, WARP 35um, and LLS Max 100/wafer @ 0.12um. Applies M12 backside lasermarking using precision polishing and laser marking systems. Requires ISO 9001 quality control program. Delivers finished 200mm Prime Grade Silicon Wafers.

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