59 -- Bump Bonding of Pixel Detector Modules Hybridization

This presolicitation, reference number 182855WPK, seeks a qualified provider for the bump bonding of pixel detector modules hybridization. The selected contractor must demonstrate a comprehensive flip-chip service capability, including mask generation, bumping, wafer thinning, dicing, and mating. Technical requirements specify the ability to handle fine pitch 100 micron and small Pb/Sn solder bumps of 30 microns or less with high yield. The scope involves processing 4 inch silicon sensor wafers and 8 inch silicon readout chip wafers, with the latter requiring thinning to 200 microns. The project demands the production of up to 900 multichip modules, each containing between 2 to 10 readout chips with a 100 micron gap between abutting edges, all within a nine month timeframe. Eligible candidates must possess at least 5 years of experience in this field, with a preference for those who have previously worked on detectors for medical applications or high energy physics. Interested parties should refer to the procurement administrator, William P Koncelik, regarding this opportunity.