This Subcontract opportunity from Department Of Defense was posted on September 24, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly (CCA) Manufacturing
Contract Overview
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AI Contract Overview
This subcontract opportunity with the Department of Defense, specifically through DLA Aviation in Oklahoma City, involves the manufacturing of Circuit Card Assemblies for prime contractors. The scope of work includes the fabrication of printed circuit boards, component soldering, and the assembly of electronic circuits tailored for aviation use. These processes must utilize surface-mount technology and electronic grade components to ensure all delivered assemblies meet strict aviation specifications. The project falls under NAICS code 334418 and was posted on September 24, 2026. Interested parties must submit their responses by the deadline of October 25, 2026.
General Info
Place of Performance
OK, USASet-Aside
Documents
This scope was carved out of SPRTA1-26-Q-0482.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
Circuit Card Assembly
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → Ok DLA Aviation At Oklahoma City
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