Circuit Card Assembly (CCA) Manufacturing

The contract calls for the full manufacturing of 30 Circuit Card Assemblies in accordance with TDP 13074673, encompassing all phases from engineering review and production through first article testing, quality assurance, packaging, and final delivery FOB destination. This is a subcontract under a Total Small Business Set-Aside, meaning only small businesses as defined by the SBA are eligible to respond, and the NAICS code 334418 applies, indicating classification within electronic component and product manufacturing. The work must be completed to meet full military-grade standards with rigorous quality controls throughout each stage. The solicitation was posted on May 5, 2026, with a firm response deadline of May 8, 2026, at 5:00 PM. The contracting activity is under the Department of Defense, specifically DLA Land Warren, and performance responsibilities are not geographically specified, allowing flexibility in facility location as long as delivery terms are met. All manufacturing activities, including testing and packaging, must ensure end-to-end compliance with technical documentation and delivery requirements without exception.