This Government Contract opportunity from Department Of Defense was posted on May 5, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly (CCA) Manufacturing
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
This contract involves the full manufacturing of 30 Circuit Card Assemblies (CCAs) in accordance with TDP 13074673. The scope includes engineering review, production, first article testing, quality assurance, packaging, and delivery FOB destination. It is a subcontract opportunity issued by DLA Land Warren under the Department of Defense, designated as a Total Small Business Set-Aside in compliance with FAR 19.5, and falls under the NAICS code 334418, which covers printed circuit assembly manufacturing. The solicitation was posted on May 5, 2026, with a response deadline of May 8, 2026, at 5:00 PM. Although specifics regarding the location of performance and point of contact are not provided, the contract emphasizes stringent quality and testing requirements to ensure adherence to technical data and delivery standards. This opportunity targets small businesses capable of meeting the detailed production and compliance criteria set forth by the Department of Defense.
General Info
Agency
NAICS
Place of Performance
MI, USASet-Aside
Documents
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Timeline
Submission Closed
