This Government Contract opportunity from Department Of Defense was posted on May 6, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly (CCA) Manufacturing
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
This contract involves the full manufacturing of a circuit card assembly (CCA), encompassing all stages from printed circuit board (PCB) fabrication through surface-mount technology (SMT) and through-hole assembly processes. The scope also includes thorough inspection, rigorous testing, and the final delivery of the assembled units, all conducted in strict compliance with military standards to ensure reliability and quality required by the Department of Defense. Issued by the SPRMM1 DLA Mechanicsburg office under the Department of Defense, this subcontract aligns with NAICS code 334418, which pertains to semiconductor and related device manufacturing. The solicitation was posted on May 6, 2026, with a response deadline of June 5, 2026. Although some contract specifics such as the solicitation number and detailed location information are not provided, the contract clearly targets subcontractors capable of meeting military-grade manufacturing and quality assurance demands for electronic circuit card assemblies.
General Info
Agency
NAICS
Place of Performance
PA, USASet-Aside
Documents
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Timeline
Submission Closed
