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Circuit Card Assembly (CCA) Manufacturing

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The contract entails the full-scale manufacturing of circuit card assemblies in strict compliance with military specifications, covering every phase from component sourcing and printed circuit board fabrication to final assembly, rigorous testing, and delivery. All work must adhere to recognized defense standards, ensuring reliability and performance under demanding operational conditions. The subcontract is issued under the Defense Logistics Agency, a division of the Department of Defense, and is classified under NAICS code 334418, which pertains to other semiconductor and related device manufacturing. The place of performance and specific office details are not disclosed, but the work is intended to support critical defense infrastructure. The contract was posted on August 5, 2026, and is available through the DIBBS system with the referenced award and delivery identifiers.

General Info

Manufacture of military-spec circuit card assemblies for defense infrastructure under DLA contract.

Agency

Department Of Defense → Defense Logistics AgencyView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M126F4822.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMBLY

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Timeline

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subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Defense Logistics Agency
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Full manufacturing of circuit card assemblies per military specifications, including component sourcing, PCB fabrication, assembly, testing, and delivery.

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