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Circuit Card Assembly (CCA) Repair and Testing

Active

Federal

Response Deadline09/21/2026, 08:30:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract opportunity with the Department of Defense, specifically through Navsup Weapon Systems Support, involves the full lifecycle repair and testing of circuit card assemblies. The scope of work encompasses a complete technical process including disassembly, cleaning, inspection, component-level repair, reassembly, and functional testing to ensure all units meet Ready for Issue standards. The project falls under NAICS code 334418 and was posted on August 24, 2026. Interested parties must submit their responses by the deadline of September 21, 2026, at 8:30 PM.

General Info

DoD subcontract for circuit card assembly repair and testing; deadline September 21, 2026.

Agency

Department Of Defense → Navsup Weapon Systems SupportView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

PA

Set-Aside

NONE

Documents

This scope was carved out of N0038326QPC64.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

66--KIT,CPU,AWTS,AIRCRA - AND OTHER REPLACEMENT PARTS, IN REPAIR/MODIFICATION OF

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Timeline

PostedAug 24

subcontract

Response DeadlineSep 21

Submission deadline

Response Deadline

09/21/2026, 08:30:00 PM UTCin 28 days

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Organization & Contact Information

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AgencyDepartment Of Defense → Navsup Weapon Systems Support

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → Navsup Weapon Systems Support

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Full lifecycle repair of circuit card assemblies including disassembly, cleaning, inspection, component-level repair, reassembly, and functional testing to meet Ready for Issue (RFI) standards.

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