Circuit Card Assembly Fabrication and Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
This subcontract involves the fabrication and assembly of three aerospace-grade Circuit Card Assemblies for the Department of Defense under the DLA Weapons Support ASC Supplier OEM Division. The scope of work includes PCB fabrication, component sourcing, and the population of electronic components using SMT or through-hole assembly lines and precision soldering to meet specific Grimes Aerospace and NSN specifications. The project requires strict adherence to MIL-STD-1916 or ASQ H1331 quality standards. Performance will take place in New Cumberland, Pennsylvania, with a response deadline set for November 13, 2026.
General Info
Place of Performance
NEW CUMBERLAND, PA, 17070-5002, USASet-Aside
Documents
This scope was carved out of SPE4A5-27-T-2817.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMBLY
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