This Government Contract opportunity from Department Of Defense was posted on September 10, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Circuit Card Assembly Fabrication and Assembly
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
This subcontract with the Department of Defense, managed by DLA Aviation at Huntsville, involves the fabrication and assembly of Circuit Card Assemblies under NSN 6130-01-681-8278. The selected provider will be responsible for fabricating PCBs and performing component population and soldering using SMT equipment within clean-room facilities. All deliverables must adhere to MIL-STD-129 for marking and MIL-STD-2073-1 for packaging to ensure full compliance with military standards. To qualify for this effort, contractors must maintain JCP certification and comply with DFARS 252.204-7012 and NIST SP 800-171 security requirements. The scope of work focuses on the delivery of completed production lots of assemblies under NAICS code 334418. The response deadline for this opportunity is October 13, 2026, with performance taking place in Huntsville.
General Info
Place of Performance
Huntsville, AL, USASet-Aside
Documents
This scope was carved out of SPRRA226R0701.
The full solicitation package (4 documents), including the RFP, is on the prime solicitation, not on this scope.
SPRRA226R0701 BRADLEY-LIMITED SOURCE-NSN: 6130016818278/ PN: 12571107
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Timeline
Submission Closed
Organization & Contact Information
Full Description
More opportunities from Department Of Defense → Al DLA Aviation At Huntsville
Same awarding agency
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