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This Government Contract opportunity from Department Of Defense was posted on September 10, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Circuit Card Assembly Fabrication and Assembly

Closed
Federal

Contract Overview

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This subcontract with the Department of Defense, managed by DLA Aviation at Huntsville, involves the fabrication and assembly of Circuit Card Assemblies under NSN 6130-01-681-8278. The selected provider will be responsible for fabricating PCBs and performing component population and soldering using SMT equipment within clean-room facilities. All deliverables must adhere to MIL-STD-129 for marking and MIL-STD-2073-1 for packaging to ensure full compliance with military standards. To qualify for this effort, contractors must maintain JCP certification and comply with DFARS 252.204-7012 and NIST SP 800-171 security requirements. The scope of work focuses on the delivery of completed production lots of assemblies under NAICS code 334418. The response deadline for this opportunity is October 13, 2026, with performance taking place in Huntsville.

General Info

DoD subcontract for fabricating Circuit Card Assemblies in Huntsville, due October 13, 2026.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Huntsville, AL, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRRA226R0701.

The full solicitation package (4 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SPRRA226R0701 BRADLEY-LIMITED SOURCE-NSN: 6130016818278/ PN: 12571107

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Al DLA Aviation At Huntsville
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufactures Circuit Card Assemblies (NSN: 6130-01-681-8278) for prime contractors on DLA supply contracts. Fabricates PCBs and performs component population and soldering using SMT equipment in clean-room facilities. Ensures compliance with MIL-STD-129 for marking and MIL-STD-2073-1 for packaging. Requires JCP certification, DFARS 252.204-7012, and NIST SP 800-171 compliance. Delivers completed production lots of assemblies.

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