Circuit Card Assembly Fabrication and Assembly
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This subcontract involves the manufacture and assembly of Circuit Card Assemblies for Department of Defense projects under the Navsup Weapon Systems Support Mech. The contractor is responsible for fabricating assemblies based on design reference 03538 77C733426G1 per TDP Version 002, utilizing both surface mount technology and through-hole equipment. The final deliverables must adhere to strict military standards, specifically MIL-STD-130 REV N for marking and MIL-STD-2073 for packaging. Additionally, the contractor must ensure full compliance with DFARS 252.225-7001 regarding domestic material requirements for the delivery of the completed assemblies under NSN 015773862.
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This scope was carved out of NO0104-26-Q-YAES.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB — 5998015773862 — N0010426QYAES
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