This Government Contract opportunity from Department Of Defense was posted on July 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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Circuit Card Assembly Manufacturing

Closed

Federal

Submission Closed08/05/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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NAICS: 334418

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AI Contract Overview

The contract requires the manufacture and delivery of circuit card assemblies identified by NSN 5998-01-079-8322, ensuring full compliance with DLA Master List specifications. Production must adhere to rigorous standards for marking, packaging, and sampling, with acceptance criteria defined by either MIL-STD-1916 or ASQ H1331. The work falls under NAICS code 334418 and is categorized as a subcontract under the Department of Defense’s ASC Commodities Division. All deliverables must meet federal defense quality and documentation requirements without deviation. The solicitation was posted on July 28, 2026, with a firm deadline for responses on August 5, 2026. The place of performance and point of contact details are not specified, and no set-aside status is indicated, meaning the opportunity is open to all qualified entities. The official reference for submissions and further details is accessible via the provided DIBBS link, which serves as the primary portal for participating vendors. Timely submission and strict adherence to technical compliance are essential for consideration.

General Info

Manufacture and deliver circuit card assemblies per DLA and MIL-STD specs, due August 5, 2026.

Agency

Department Of Defense → ASC COMMODITIES DIVISION

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of SPE4A6-26-T-10EH.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

AI Contract Breakdown

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Timeline

PhaseClosed

PostedJul 28

subcontract

Response DeadlineAug 5

Deadline has passed

Submission Closed

08/05/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ASC COMMODITIES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → ASC COMMODITIES DIVISION

Office AddressN/A

ContactsNo contact information available

Full Description

Manufacture and delivery of circuit card assemblies (NSN: 5998-01-079-8322) compliant with DLA Master List specifications, including marking, packaging, and sampling per MIL-STD-1916 or ASQ H1331.