Circuit Card Assembly Manufacturing
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The contract requires the manufacture and delivery of circuit card assemblies identified by NSN 5998-01-079-8322, ensuring full compliance with DLA Master List specifications. Production must adhere to rigorous standards for marking, packaging, and sampling, with acceptance criteria defined by either MIL-STD-1916 or ASQ H1331. The work falls under NAICS code 334418 and is categorized as a subcontract under the Department of Defense’s ASC Commodities Division. All deliverables must meet federal defense quality and documentation requirements without deviation. The solicitation was posted on July 28, 2026, with a firm deadline for responses on August 5, 2026. The place of performance and point of contact details are not specified, and no set-aside status is indicated, meaning the opportunity is open to all qualified entities. The official reference for submissions and further details is accessible via the provided DIBBS link, which serves as the primary portal for participating vendors. Timely submission and strict adherence to technical compliance are essential for consideration.
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