Circuit Card Assembly Manufacturing

The contract seeks complete manufacturing of circuit card assemblies, encompassing full lifecycle production from component sourcing and PCB fabrication to surface-mount and through-hole assembly, soldering, and initial quality inspection. The work is required to meet stringent defense-grade standards and must be performed at Hill Air Force Base, Utah, with the final deliverables expected to support military hardware systems. All materials and processes must comply with relevant military and industry specifications to ensure reliability and performance under operational conditions. This subcontract opportunity, issued under NAICS code 334418 by the Department of Defense’s ASC Supplier Operations OEM Division, has a response deadline of August 6, 2026, with the solicitation posted on July 29, 2026. There is no set-aside designation specified, and the contract is open to qualified manufacturers capable of end-to-end production within the defined timeframe and location. Interested parties must submit proposals through the DIBBS platform, ensuring alignment with technical requirements and delivery schedules tied to critical defense supply chain needs.