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This Government Contract opportunity from Department Of Defense was posted on September 2, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Circuit Card Assembly (NSN 5998010658642) Supplier

Closed
Federal

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This subcontract involves the manufacture or sourcing of six Circuit Card Assemblies meeting NSN 5998010658642 specifications to support DLA Land and Maritime FMS requirements for Turkey. The supplier is responsible for providing the physical units along with a complete Data Package for all approved or alternate parts. To be eligible, contractors must possess a valid CAGE code and maintain NIST SP 800-171 compliance for the protection of covered defense information. This opportunity is managed by the Department of Defense under the Maritime Supply Chain agency, with a response deadline of September 8, 2026.

General Info

Supply six Circuit Card Assemblies for DLA Turkey by September 8, 2026.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M1-26-T-7506.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → MARITIME SUPPLY CHAIN
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Supplies Circuit Card Assemblies for prime contractors delivering DLA Land and Maritime FMS requirements for Turkey. Manufactures or sources the specific assembly meeting NSN 5998010658642 specifications and provides a complete Data Package for approved or alternate parts. Requires NIST SP 800-171 compliance for safeguarding covered defense information and a valid CAGE code. Delivers 6 units of the assembly and associated technical data packages.

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Keith Deutsch
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