CIRCUIT CARD ASSEMBLY

Solicitation SPE7M1-26-T-370G is a Request for Quotations issued by DLA Land and Maritime for the procurement of 7,000 Circuit Card Assemblies, specifically Dynalec Corporation part number 62413-140 (NSN 5998-01-458-8779). Designated as a critical application item, the procurement requires adherence to NAICS 334412 and incorporates the DLA Master Solicitation for Automated Simplified Acquisitions Revision 105. Key delivery milestones include a need ship date of March 16, 2027, and an original required delivery date of August 13, 2027, with shipping designated as FOB Origin to the DLA Distribution DDSP New Cumberland Facility in Pennsylvania. The contract mandates rigorous technical and safety standards, including a CMMC Level 2 Self-Assessment and strict prohibitions against the intentional addition of mercury. Because the assemblies are electrostatic sensitive devices, they must be handled at approved field force protective work stations and packaged using DOD qualified materials per MIL-PRF-81705 and MIL-STD-2073-1E, with marking compliant with MIL-STD-129. Technical specifications recommend the use of MIL-PRF-31032 for printed circuit boards. Award evaluation will exclude any items produced via additive manufacturing unless authorized, and the government will utilize the HUBZone price evaluation preference. Invoicing and receiving reports must be processed electronically through the Wide Area Workflow system.