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This Government Contract opportunity from Department Of Defense was posted on August 30, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Component Marking and Packaging Compliance

Closed
Federal

Contract Overview

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This subcontract involves providing specialized marking and packaging services for electronic components supporting prime contractors on Department of Defense projects within the Active Devices Division. The scope of work requires the application of Lead and Pb-Free markings in accordance with IPC/JEDEC J-STD-609 and the execution of packaging processes that adhere to MIL-STD-129, MIL-DTL-19491, and MIL-STD-2073-1E. The service provider must utilize marking equipment that meets IPC/JEDEC standards to ensure all components are delivered, labeled, and packaged in full compliance with military and industry requirements. This opportunity is categorized under NAICS code 339999, with a response deadline set for September 10, 2026.

General Info

Subcontract for DoD electronic component marking and packaging services due September 10, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

339999 - All Other Miscellaneous ManufacturingView NAICS

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-453J.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVICE, T

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Performs specialized marking and packaging for electronic components for prime contractors on DLA Active Devices Division projects. Applies Lead (Pb) and Pb-Free markings per IPC/JEDEC J-STD-609 and executes packaging per MIL-STD-129, MIL-DTL-19491, and MIL-STD-2073-1E. Utilizes marking equipment meeting IPC/JEDEC standards. Delivers components packaged and labeled in full compliance with military and industry standards.

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Solicitation # SPE7M5-26-T-455B
Solicitation SPE7M5-26-T-455B, issued by DLA Land and Maritime Active Devices Division, is a request for quotations for four linear microcircuits, identified by NSN 5962012477674 and part number HI1-5047A/883 from Renesas Electronics America Inc. The procurement is for a critical application item and is categorized as a commercial item. Delivery is required within 143 days, with a need ship date of February 2, 2027, and a final required delivery date of July 1, 2027. Inspection and acceptance will occur at the destination, specifically DLA Distribution DDWO in Columbus, Ohio. The contract imposes stringent quality and technical requirements, including CMMC Level 2 self-assessment and strict supply chain traceability. Contractors must provide DLA Land and Maritime Form 918 and associated traceability or test reports at least 15 days prior to the delivery date to receive shipping authorization. Packaging must adhere to MIL-STD-2073-1E and MIL-PRF-81705 for ESD and EMI protection, with specific cushioning requirements per A-A-59136 to prevent lead damage. Marking must comply with MIL-STD-129 and IPC/JEDEC J-STD-609 for lead finish identification. Additionally, the contractor must ensure that mercury is not intentionally added to the hardware and must comply with the Buy American and Balance of Payments Program. All quotes must be submitted via the DIBBS portal by September 11, 2026.
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