Custom FPGA PCB Fabrication (High-Density, Controlled Impedance)

This contract involves the fabrication of 150 custom high-density printed circuit boards (PCBs) designed specifically for FPGA carrier applications. The PCBs require intricate controlled impedance routing and fine-pitch features, indicating a focus on high-precision manufacturing to meet specialized electronic performance standards. The solicitation was issued by NASA Shared Services Center under the National Aeronautics and Space Administration, with the relevant industry categorized under NAICS code 334418, which covers printed circuit board manufacturing. The contract is classified as a subcontract, with a response deadline set shortly after its posting date in early June 2026, reflecting an expedited procurement timeline. Although specific location details for the place of performance and contact information are not provided, the project emphasizes advanced PCB fabrication techniques needed to support aerospace-related FPGA carrier requirements, highlighting the importance of accuracy and quality in producing components for critical hardware systems.