Direct Bonding Process Development for Infrared FPAs

This contract involves the development and validation of a zinc sulfide (ZnS)-based direct bonding process intended to replace the existing epoxy method in the manufacture of dual-band infrared focal plane arrays (FPAs). The objective is to enhance the sensitivity and production yield of these infrared detectors, which are critical components in various defense applications. The work will be performed as a subcontract for the Department of Defense, with the place of performance specified as Fort Belvoir. The effort falls under NAICS code 334418, indicating it pertains to electronic component manufacturing. By advancing the bonding technology from epoxy to a direct ZnS-based approach, this project aims to improve the operational performance and reliability of infrared FPAs, which can have significant implications for defense sensing and imaging systems. The contract was posted in late May 2026, and it focuses on cutting-edge materials and process engineering to enhance the production quality of key infrared detector assemblies.