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Direct Bonding Process Development for Infrared FPAs

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This contract involves the development and validation of a zinc sulfide (ZnS)-based direct bonding process intended to replace the existing epoxy method in the manufacture of dual-band infrared focal plane arrays (FPAs). The objective is to enhance the sensitivity and production yield of these infrared detectors, which are critical components in various defense applications. The work will be performed as a subcontract for the Department of Defense, with the place of performance specified as Fort Belvoir. The effort falls under NAICS code 334418, indicating it pertains to electronic component manufacturing. By advancing the bonding technology from epoxy to a direct ZnS-based approach, this project aims to improve the operational performance and reliability of infrared FPAs, which can have significant implications for defense sensing and imaging systems. The contract was posted in late May 2026, and it focuses on cutting-edge materials and process engineering to enhance the production quality of key infrared detector assemblies.

General Info

Develop ZnS-based bonding to replace epoxy, improving infrared dual-band FPA sensitivity and yield.

Agency

Department Of Defense → W6QK Acc-Apg

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing View NAICS

Place of Performance

Fort Belvoir, VA, USA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

Posted

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → W6QK Acc-Apg
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → W6QK Acc-Apg
Office AddressN/A
ContactsNo contact information available

Full Description

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Develop and validate a ZnS-based direct bonding process to replace epoxy in dual-band infrared focal plane array manufacturing, improving sensitivity and yield.

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