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Dongle Hardware Manufacturing and Assembly

Active

Federal

Response Deadline09/28/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract involves the manufacturing and assembly of dongle hardware for prime contractors under Department of Defense supply contracts. The scope of work includes the fabrication of the hardware devices and the assembly of internal electronic components and PCBs. All production must strictly adhere to the DLA Master List of Technical and Quality Requirements RA001, and the provider is responsible for submitting Source Approval Request documentation in accordance with RC001. The opportunity is categorized under NAICS code 334112 and is managed by the Construction and Equipment T and IFO EQ agency. Interested parties must respond by September 28, 2026, to provide the completed dongle units as specified in the requirements.

General Info

Manufacturing and assembling DoD dongle hardware per RA001 and RC001 by September 28, 2026.

Agency

Department Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQView Agency

NAICS

334112 - Computer Storage Device ManufacturingView NAICS

Place of Performance

USA

Set-Aside

NONE

Documents

This scope was carved out of SPE8EN-26-T-3163.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

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DONGLE

AI Contract Breakdown

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Timeline

PostedSep 15

subcontract

Response DeadlineSep 28

Submission deadline

Response Deadline

09/28/2026, 05:00:00 PM UTCin 12 days

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Organization & Contact Information

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AgencyDepartment Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQ

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → CONSTRUCTION & EQUIPMENT T & IFO EQ

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Office AddressN/A

ContactsNo contact information available

Full Description

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Manufactures and assembles dongle hardware for prime contractors on DLA supply contracts. Fabricates the hardware device and assembles internal components including PCBs and electronic components. Adheres to the DLA Master List of Technical and Quality Requirements (RA001) and provides Source Approval Request (SAR) documentation per RC001. Delivers completed dongle units.

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