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Electronic Component Supply – NSN 5998-00-469-1507

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract involves the manufacturing, testing, packaging, and delivery of a discrete semiconductor or sensor component identified by NSN 5998-00-469-1507. The project is managed by the Defense Logistics Agency under the Department of Defense and requires strict adherence to DLA standards to ensure component quality and functionality. Classified under NAICS code 334418, the contract focuses on the specialized production of electronic components. The agreement outlines the necessary technical requirements for the supply chain process, from initial fabrication to final delivery, ensuring the components meet the specific military specifications required for government use.

General Info

DLA subcontract for manufacturing and delivering semiconductor component NSN 5998-00-469-1507 to military specifications.

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M525P5573.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

ELECTRONIC COMPONEN

AI Contract Breakdown

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Timeline

Posted

subcontract

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufacturing, testing, packaging, and delivery of a discrete semiconductor or sensor component under NSN 5998-00-469-1507 in compliance with DLA standards.

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