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Electronic Components Assembly and Packaging

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Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract with the Defense Logistics Agency involves the full assembly and packaging of electronic components. The contractor is required to adhere strictly to the RP001 standard and ensure full compliance with MIL-STD-129 and ASTM D3951. These regulations govern the preservation, palletization, and handling of sensitive materials to meet rigorous military specifications. The project falls under NAICS code 334418 and is managed by the Department of Defense. All deliverables must align with the DLA Master List requirements to ensure quality control and standardized logistics for the electronic components provided.

General Info

DLA subcontract for electronic component assembly and packaging meeting military quality standards.

Agency

Department Of Defense → Defense Logistics Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M1-26-Q-0088.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

59--ELECTRONIC COMPONEN

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Timeline

PostedJun 9

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency

ContactsNo contacts available

OfficeN/A

Organization / AgencyDepartment Of Defense → Defense Logistics Agency

Office AddressN/A

ContactsNo contact information available

Full Description

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Full assembly and packaging of electronic components per DLA’s RP001 standard, including compliance with MIL-STD-129, ASTM D3951, and DLA Master List requirements for preservation, palletization, and handling of sensitive materials.

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