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This Government Contract opportunity from Department Of Defense was posted on April 29, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Electronics Assembly and Testing Services

Closed
Federal

Contract Overview

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This contract involves providing electronics assembly and testing services, specifically focusing on surface mount and through-hole assembly, soldering, conformal coating, and functional testing of circuit card assemblies. All work will be conducted in electrostatic discharge (ESD)-safe environments to ensure the protection and quality of the components. The services are intended to support defense-related operations, as the contract is managed by the Department of Defense through the SPRMM1 DLA Mechanicsburg office. The contract is categorized under NAICS code 334419 and is offered as a subcontract, with a response deadline set for May 29, 2026. The place of performance is located in Mechanicsburg, emphasizing the regional focus of the work. While some specific details such as the solicitation number and point of contact are not provided, the contract’s purpose is clear in its support for advanced electronics manufacturing and quality assurance for military or defense applications.

General Info

Electronics assembly, testing, and coating services for defense in ESD-safe Mechanicsburg facility subcontract.

Agency

Department Of Defense → SPRMM1 DLA Mechanicsburg

NAICS

334419 - Other Electronic Component Manufacturing View NAICS

Place of Performance

Mechanicsburg, PA, USA

Set-Aside

NONE

Documents

(0)

No documents available

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → SPRMM1 DLA Mechanicsburg
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → SPRMM1 DLA Mechanicsburg
Office AddressN/A
ContactsNo contact information available

Full Description

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Surface mount and through-hole assembly, soldering, conformal coating, and functional testing of circuit card assemblies in ESD-safe environments.