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This Combined Synopsis/Solicitation opportunity was posted on June 17, 2019. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Electroplating Station for Silicon Wafers

Awarded
80NSSC19Q0630Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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General Info

Agency

N/A

Contract Value

$29,570

NAICS

332813 - Electroplating, Plating, Polishing, Anodizing, and Coloring

Place of Performance

NASA Goddard Space Flight Center, GREENBELT, MD, 20771, USA

Set-Aside

SBA

Award Issued Date

Documents

0

No documents available

Documents will appear here when they are available.

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Timeline

4 updates
PhaseAwarded
Posted

Combined Synopsis

Notice updated

Response deadline changed from May 31, 2019 to Jun 14, 2019. The notice description changed.

Notice updated

The notice description changed.

Notice updated

The notice description changed.

Notice updated

Response deadline changed from Jun 14, 2019 to Jun 17, 2019. The notice description changed.

Awarded

Contract was awarded

Submission Closed

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Organization & Contact Information

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AgencyN/A
Contacts1 person available
OfficeN/A
Organization / Agency
N/A
Office AddressN/A
Contacts
Donna S. MartinProcurement Specialist

Full Description

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QUESTION: Statement of work paragraph 2 Please define what "production level tool" means. ANSWER: "Production level tool" refers to the quality and reproducibility of the Au layer the tool can produce. For example, if we requested a certain thickness uniformity - the tool would need to reproduce the spec every run. And if we requested certain deposition conditions, such as target temperature with temperature stability, again these would need to be monitored and demonstrably reproducible from run to run. We do not require high throughput on the tool. For example, it is not a multiwafer system.

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Miguel
Hillary
Keith Deutsch
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