This Government Contract opportunity from Department Of Defense was posted on July 13, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Electrostatic Discharge (ESD)-Sensitive Electronics Packaging
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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AI Contract Overview
The contract requires the packaging of electrostatic-sensitive devices, including circuit card assemblies, using materials and methods that comply strictly with MIL-STD-2073-1, MIL-HDBK-773, and ANSI/ESD S20.20 standards to ensure protection against electrostatic discharge. All packaging processes must adhere to industry-approved ESD controls to maintain the integrity and functionality of sensitive electronic components throughout handling, storage, and transportation. The work is classified as a subcontract under NAICS code 334418, indicating involvement in other electronic component manufacturing, and is issued by the Department of Defense through the U.S. Defense Logistics Agency Aviation at Ogden. The solicitation was posted on July 13, 2026, with a firm response deadline of August 17, 2026, at 8:00 PM. The place of performance and specific location details are not provided, suggesting that the contractor may have flexibility in where the work is executed as long as compliance and delivery requirements are met. No set-aside specifications or small business preferences are indicated, and the point of contact information is not listed, meaning potential bidders must rely on the official SAM.gov platform for further inquiries or documentation access through the provided UI link.
General Info
Agency
NAICS
Place of Performance
UT, USASet-Aside
Documents
This scope was carved out of SPRHA1-26-R-0782.
The full solicitation package (4 documents), including the RFP, is on the prime solicitation, not on this scope.
Circuit Card Assembly (26-R-0782)
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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