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This Government Contract opportunity from Department Of Defense was posted on July 13, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

Electrostatic Discharge (ESD)-Sensitive Electronics Packaging

Closed
Federal

Contract Overview

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The contract requires the packaging of electrostatic-sensitive devices, including circuit card assemblies, using materials and methods that comply strictly with MIL-STD-2073-1, MIL-HDBK-773, and ANSI/ESD S20.20 standards to ensure protection against electrostatic discharge. All packaging processes must adhere to industry-approved ESD controls to maintain the integrity and functionality of sensitive electronic components throughout handling, storage, and transportation. The work is classified as a subcontract under NAICS code 334418, indicating involvement in other electronic component manufacturing, and is issued by the Department of Defense through the U.S. Defense Logistics Agency Aviation at Ogden. The solicitation was posted on July 13, 2026, with a firm response deadline of August 17, 2026, at 8:00 PM. The place of performance and specific location details are not provided, suggesting that the contractor may have flexibility in where the work is executed as long as compliance and delivery requirements are met. No set-aside specifications or small business preferences are indicated, and the point of contact information is not listed, meaning potential bidders must rely on the official SAM.gov platform for further inquiries or documentation access through the provided UI link.

General Info

Package electrostatic-sensitive devices per MIL-STD-2073-1, MIL-HDBK-773, ANSI/ESD S20.20 for DoD by August 17, 2026.

Agency

Department Of Defense → Ut DLA Aviation At Ogden

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

UT, USA

Set-Aside

NONE

Documents

This scope was carved out of SPRHA1-26-R-0782.

The full solicitation package (4 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

Circuit Card Assembly (26-R-0782)

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → Ut DLA Aviation At Ogden
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → Ut DLA Aviation At Ogden
Office AddressN/A
ContactsNo contact information available

Full Description

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Packaging of electrostatic-sensitive devices such as circuit card assemblies using ESD-protective materials and methods per MIL-STD-2073-1, MIL-HDBK-773, and ANSI/ESD S20.20.

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Miguel
Hillary
Keith Deutsch
Christine

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