This Government Contract opportunity from Department Of Defense was posted on July 30, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
ESD-Compliant Packaging and Assembly
Contract Overview
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AI Contract Overview
The contract requires the packaging and assembly of microcircuit assemblies and electronic components using materials compliant with Electrostatic Discharge (ESD) protection standards, adhering strictly to military specifications including MIL-PRF-81705, MIL-DTL-117, and MIL-STD-2073-1E. All packaging must provide adequate cushioning and preservation to ensure the integrity of sensitive electronic components during handling and transit. The work is to be performed at the specified location in Columbus, Ohio, with a zip code of 43213, and is classified as a subcontract under NAICS code 334418. The solicitation was posted on July 30, 2026, with a firm deadline for responses on August 10, 2026. The contracting authority is the Department of Defense through the Maritime Supply Chain ESOC Buys organization, indicating this effort supports defense logistics and supply chain requirements for critical electronic systems.
General Info
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M0-26-T-024R.
The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT ASSEMBLY
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
Earlier notices in this NAICS code
Posted before this notice, open and closed
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