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ESD/EMI-Compliant Packaging & Preservation

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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The Active Devices Division of the Department of Defense is seeking a subcontractor for the design and execution of protective packaging for sensitive electronic components. This project requires strict adherence to MIL-STD-2073-1E and A-A-59136 standards to ensure comprehensive ESD and EMI compliance. The performance of this contract will take place in Columbus, Ohio. Interested parties must submit their responses by the deadline of September 10, 2026, following the posting date of August 30, 2026.

General Info

DoD seeks subcontractor for electronic protective packaging in Columbus, Ohio by September 10, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

326199 - All Other Plastics Product ManufacturingView NAICS

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-453A.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, DIGITA

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Organization / Agency
Department Of Defense → ACTIVE DEVICES DIVISION
View Agency Profile
Office AddressN/A
ContactsNo contact information available

Full Description

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Design and execution of ESD and EMI protective packaging per MIL-STD-2073-1E and A-A-59136 for sensitive electronic components.

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DIBBS
SEMICONDUCTOR DEVIC
Solicitation # SPE7M5-26-T-396N
This solicitation is for a single semiconductor diode item identified by NSN 5961-01-269-3123 under the Department of Defense's Active Devices Division, with a required delivery within five days of award. The contract is governed by simplified acquisition procedures and incorporates stringent technical, quality, packaging, and traceability mandates from the DLA Master List of Technical and Quality Requirements, including specific requirements for qualified suppliers, supply chain traceability documentation retention per DLA Directive Procurement Note C03 (August 2016), and physical marking of bare items. The item must comply with MIL-STD-2073-1E for packaging, MIL-DTL-19491 for preservation and packaging of semiconductors, and MIL-STD-129 for marking and labeling, with unit packaging adhering to IPC/JEDEC J-STD-609 for lead finish identification. Hazard communication standards and regulations for radioactive materials apply, and all shipments must follow FOB Origin terms to the delivery site at Robins AFB, Georgia. The offeror must ensure the product is sourced from qualified suppliers listed under FSC 5961 and 5962, and must retain comprehensive supply chain documentation. The contract includes federal acquisition regulation clauses covering equal opportunity, trafficking in persons, employment eligibility, sustainable products, hazardous materials, cyber incident reporting, cybersecurity compliance with NIST SP 800-171, prohibition of hexavalent chromium, and restrictions on acquisition of equipment from Communist Chinese military companies. Payment must be processed electronically through Wide Area WorkFlow, and the contractor must submit complete data packages for both the approved and alternate parts. Compliance with all applicable representations and certifications is mandatory, including disclosure of unique entity identifiers, socioeconomic status, and any provision of covered defense telecommunications equipment. No pricing data is provided in the solicitation, and the contract type remains unspecified pending final determination by the contracting officer.
Semiconductor and Related Device Manufacturing

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about 5 hours ago

DEADLINE

in 2 days
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