ESD/EMI-Compliant Packaging & Preservation
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
AI Contract Overview
The Active Devices Division of the Department of Defense is seeking a subcontractor for the design and execution of protective packaging for sensitive electronic components. This project requires strict adherence to MIL-STD-2073-1E and A-A-59136 standards to ensure comprehensive ESD and EMI compliance. The performance of this contract will take place in Columbus, Ohio. Interested parties must submit their responses by the deadline of September 10, 2026, following the posting date of August 30, 2026.
General Info
Agency
NAICS
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-453A.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITA
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Timeline
Response Deadline
Organization & Contact Information
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