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ESD/EMI-Compliant Packaging and Preservation Services

Active
Federal

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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This subcontract, issued by the Defense Logistics Agency under the Department of Defense, requires the provision of specialized packaging, preservation, and marking services for semiconductor devices. The primary objective is to ensure all materials are handled in strict accordance with MIL-STD compliance to maintain component integrity during transport and storage. The scope of work specifically mandates the use of ESD and EMI barrier materials along with designated cushioning to protect sensitive electronics from electrostatic discharge and electromagnetic interference. These services are categorized under NAICS code 339999, focusing on high-standard protective measures for critical defense hardware.

General Info

DLA subcontract for MIL-STD compliant packaging, preservation, and marking of semiconductor devices.

NAICS

339999 - All Other Miscellaneous Manufacturing

Place of Performance

Not specified

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-P-3978.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

SEMICONDUCTOR DEVIC

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Timeline

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Organization & Contact Information

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AgencyDepartment Of Defense → Defense Logistics Agency
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Provide MIL-STD-compliant packaging, preservation, and marking of semiconductor devices using ESD/EMI barrier materials and specified cushioning.

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