This Government Contract opportunity from Department Of Defense was posted on July 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
ESD/EMI-Compliant Packaging of Electronic Components
Contract Overview
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AI Contract Overview
The contract requires the packaging of electronic components using electrostatic discharge and electromagnetic interference protective materials that meet military standards, specifically MIL-PRF-81705, to ensure protection against electrostatic and physical damage during transportation. This subcontract is issued by the Active Devices Division under the Department of Defense and is focused solely on ensuring compliance with rigorous defense-grade packaging specifications to safeguard sensitive electronics in transit. The place of performance is designated as New Cumberland, Pennsylvania, with a zip code of 17070-5002, indicating the operational location where the packaged components will be processed or shipped from. The solicitation was posted on July 23, 2026, and responses are due by August 3, 2026, providing a limited window for qualified vendors to submit proposals. The contract falls under NAICS code 325991, which categorizes it under Other Chemical Product and Preparation Manufacturing, aligning with the production of specialized protective materials rather than the electronic components themselves. The contract does not specify a set-aside designation, meaning it is open to all eligible contractors without preference for small businesses or other categories. Potential bidders must ensure their packaging solutions fully adhere to MIL-PRF-81705 requirements and are capable of withstanding the environmental and handling stresses inherent in military logistics.
General Info
Agency
NAICS
Place of Performance
NEW CUMBERLAND, PA, 17070-5002, USASet-Aside
Documents
This scope was carved out of SPE7M5-26-T-348B.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
RESISTOR, THERMAL
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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