This Government Contract opportunity from Department Of Defense was posted on July 23, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
ESD/EMI Protective Packaging and Preservation
Contract Overview
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AI Contract Overview
The contract requires the design and implementation of protective packaging for circuit card assemblies that are sensitive to electrostatic discharge and electromagnetic interference, following strict military standards MIL-PRF-81705 and MIL-STD-2073-1E. All packaging materials must be sourced from the Qualified Products List under QPL-81705 to ensure compliance with defense-grade protection requirements. The work involves not only the physical construction of the packaging but also proper preservation techniques to maintain the integrity of sensitive electronics during storage and transit. This subcontract is part of a broader defense logistics initiative managed by the Department of Defense under the Maritime Supply Chain ESOC Buys division, with a focus on securing critical electronic components for naval and defense systems. The solicitation was posted on July 23, 2026, and responses are due by August 6, 2026, with no set-aside provisions specified, indicating open competition among qualified suppliers.
General Info
Agency
NAICS
Place of Performance
USASet-Aside
Documents
This scope was carved out of SPE7M0-26-Q-1088.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
CIRCUIT CARD ASSEMB
AI Contract Breakdown
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Timeline
Submission Closed
Organization & Contact Information
Full Description
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