ESD/EMI Protective Packaging Services for Microcircuits
Contract Overview
Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.
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This subcontract involves providing specialized ESD and EMI protective packaging services for microcircuits supporting the DLA Weapons Support Active Devices Division. The contractor is responsible for utilizing approved field force protective workstations and MIL-PRF-81705 materials to ensure components are shielded from damage. All items must be marked and packaged in strict accordance with MIL-STD-129, IPC/JEDEC J-STD-609, and MIL-STD-2073-1E standards to ensure they are ready for shipment via DLA Distribution DDWO. The project is categorized under NAICS code 339999 and will be performed in Columbus, Ohio. Interested parties must note the response deadline of October 26, 2026, for this Department of Defense requirement.
General Info
Place of Performance
COLUMBUS, OH, 43213, USASet-Aside
Documents
This scope was carved out of SPE7M5-27-T-1033.
The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.
MICROCIRCUIT, DIGITAL
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