This Government Contract opportunity from Department Of Defense was posted on May 31, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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ESD/EMI Protective Packaging Supply

Closed

Federal

Submission Closed06/08/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

The contract involves the supply of certified electrostatic discharge (ESD) and electromagnetic interference (EMI) protective packaging materials specifically designed for shipping circuit card assemblies. These materials must comply with military standards MIL-PRF-81705 and MIL-DTL-117 to ensure proper protection of sensitive electronic components during transportation. The procurement is for a subcontract under NAICS code 325992, which corresponds to the manufacturing of materials used in chemical products. The contracting agency is the ASC SUPPLIER OPER OEM DIVISION within the Department of Defense, with the place of performance specified at Robins Air Force Base, ZIP code 31098-1887. The solicitation was posted on May 31, 2026, with a response deadline set for June 8, 2026. The contract requires suppliers capable of meeting these stringent military specifications to provide high-quality packaging solutions that maintain the integrity and functionality of circuit card assemblies during shipment.

General Info

Supply MIL-standard ESD and EMI protective packaging for circuit card assemblies, DoD contract, Robins AFB.

Agency

Department Of Defense → ASC SUPPLIER OPER OEM DIVISIONView Agency

NAICS

325992 - Photographic Film, Paper, Plate, Chemical, and Copy Toner ManufacturingView NAICS

Place of Performance

ROBINS A F B, GA, 31098-1887, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE4A5-26-T-196S.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

CIRCUIT CARD ASSEMB

AI Contract Breakdown

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No contract breakdown available.

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Timeline

PhaseClosed

PostedMay 31

subcontract

Response DeadlineJun 8

Deadline has passed

Submission Closed

06/08/2026, 05:00:00 PM UTC

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Organization & Contact Information

AgencyDepartment Of Defense → ASC SUPPLIER OPER OEM DIVISION

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ASC SUPPLIER OPER OEM DIVISION

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

Supply of certified ESD and EMI protective packaging materials compliant with MIL-PRF-81705 and MIL-DTL-117 for use in shipping circuit card assemblies.