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ESD-Safe and MIL-STD-2073-1E Compliant Packaging

Active

Federal

Response Deadline09/04/2026, 05:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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The Active Devices Division of the Department of Defense is seeking a subcontractor for the manufacture and supply of ESD-protective and cushioned packaging designed for sensitive electronic components. All materials must strictly comply with MIL-PRF-81705 and MIL-STD-2073-1E standards to ensure the safety and integrity of the electronics. This opportunity is categorized under NAICS code 326199 and will be performed in Columbus, Ohio. Interested parties must submit their responses by the deadline of September 4, 2026.

General Info

DoD seeks subcontractor for MIL-spec electronic packaging in Columbus, Ohio by September 4, 2026.

Agency

Department Of Defense → ACTIVE DEVICES DIVISIONView Agency

NAICS

326199 - All Other Plastics Product ManufacturingView NAICS

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-438Y.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, LINEAR

AI Contract Breakdown

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Timeline

PostedAug 24

subcontract

Response DeadlineSep 4

Submission deadline

Response Deadline

09/04/2026, 05:00:00 PM UTCin 9 days

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → ACTIVE DEVICES DIVISION

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Manufacture and supply of ESD-protective and cushioned packaging compliant with MIL-PRF-81705 and MIL-STD-2073-1E for sensitive electronic components.

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