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This Government Contract opportunity from Department Of Defense was posted on August 24, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

ESD-Safe and MIL-STD-2073-1E Compliant Packaging

Closed
Federal

Contract Overview

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The Active Devices Division of the Department of Defense is seeking a subcontractor for the manufacture and supply of ESD-protective and cushioned packaging designed for sensitive electronic components. All materials must strictly comply with MIL-PRF-81705 and MIL-STD-2073-1E standards to ensure the safety and integrity of the electronics. This opportunity is categorized under NAICS code 326199 and will be performed in Columbus, Ohio. Interested parties must submit their responses by the deadline of September 4, 2026.

General Info

DoD seeks subcontractor for MIL-spec electronic packaging in Columbus, Ohio by September 4, 2026.

NAICS

326199 - All Other Plastics Product Manufacturing

Place of Performance

COLUMBUS, OH, 43213, USA

Set-Aside

NONE

Documents

This scope was carved out of SPE7M5-26-T-438Y.

The full solicitation package (1 document), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

MICROCIRCUIT, LINEAR

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Timeline

PhaseClosed
Posted

subcontract

Response Deadline

Deadline has passed

Submission Closed

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Organization & Contact Information

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AgencyDepartment Of Defense → ACTIVE DEVICES DIVISION
ContactsNo contacts available
OfficeN/A
Office AddressN/A
ContactsNo contact information available

Full Description

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Manufacture and supply of ESD-protective and cushioned packaging compliant with MIL-PRF-81705 and MIL-STD-2073-1E for sensitive electronic components.

Earlier notices in this NAICS code

Posted before this notice, open and closed

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Miguel
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Keith Deutsch
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