This Government Contract opportunity from National Aeronautics And Space Administration was posted on June 2, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
Fine-Pitch Surface Mount Assembly (SMT)
Contract Overview
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This contract involves the surface mount technology (SMT) assembly of fine-pitch electronic components, including ball grid arrays (BGAs) and quad flat no-lead packages (QFNs). The scope includes reflow soldering processes along with automated optical inspection (AOI) and X-ray inspection to ensure quality and reliability of the assemblies. The work is categorized under NAICS code 334419, which pertains to other electronic component manufacturing. It is a subcontract opportunity issued by the NASA Shared Services Center on behalf of the National Aeronautics and Space Administration. The contract was posted on June 2, 2026, with responses due by June 4, 2026. Specific details regarding the place of performance, organizational type, set-aside status, and a designated point of contact are not provided. The key focus is on precision assembly and inspection of fine-pitch components critical for advanced electronics, reflecting high standards typical of NASA procurement requirements. Interested parties can view more information and respond to the solicitation via the provided federal contracting website.
General Info
Agency
NAICS
Place of Performance
MSSet-Aside
Documents
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Timeline
Submission Closed
