This Government Contract opportunity from National Aeronautics And Space Administration was posted on May 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.
High-Frequency PCB Fabrication (Microwave Substrate)
Contract Overview
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AI Contract Overview
The contract involves the fabrication of 12-layer radio frequency printed circuit boards (PCBs) using low-loss microwave substrates, specifically Astra MT77. Critical requirements include precise control over the stack-up configuration, trace geometry, via dimensions, and dielectric properties to ensure optimal performance of antenna systems. This attention to detail is essential for maintaining the integrity and functionality of high-frequency signal transmission within the PCBs. This subcontract is a total small business set-aside under the NAICS code 334418, relating to electronic component manufacturing, issued by the NASA Shared Services Center. The work is to be performed in Cleveland, with a response deadline set for June 3, 2026. The contract emphasizes compliance with stringent technical specifications, reflecting its application in advanced aerospace or related high-frequency communications technologies.
General Info
Agency
NAICS
Place of Performance
Cleveland, OH, 44135, USASet-Aside
Documents
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Timeline
Submission Closed
