This Government Contract opportunity from National Aeronautics And Space Administration was posted on May 28, 2026. The submission period has ended. Browse the details below for market research, or find similar active opportunities.

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High-Frequency PCB Fabrication (Microwave Substrate)

Closed

Federal

Submission Closed06/03/2026, 09:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

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AI Contract Overview

The contract involves the fabrication of 12-layer radio frequency printed circuit boards (PCBs) using low-loss microwave substrates, specifically Astra MT77. Critical requirements include precise control over the stack-up configuration, trace geometry, via dimensions, and dielectric properties to ensure optimal performance of antenna systems. This attention to detail is essential for maintaining the integrity and functionality of high-frequency signal transmission within the PCBs. This subcontract is a total small business set-aside under the NAICS code 334418, relating to electronic component manufacturing, issued by the NASA Shared Services Center. The work is to be performed in Cleveland, with a response deadline set for June 3, 2026. The contract emphasizes compliance with stringent technical specifications, reflecting its application in advanced aerospace or related high-frequency communications technologies.

General Info

Fabrication of 12-layer RF PCBs with Astra MT77 substrates for aerospace, small business set-aside.

Agency

National Aeronautics And Space Administration → NASA Shared Services CenterView Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

Cleveland, OH, 44135, USA

Set-Aside

SBA

Documents

This scope was carved out of 80NSSC26933620Q.

The full solicitation package (7 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

ADaPT Gen III PCB Fabrication/Assembly

AI Contract Breakdown

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No contract breakdown available.

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Timeline

PhaseClosed

PostedMay 28

subcontract

Response DeadlineJun 3

Deadline has passed

Submission Closed

06/03/2026, 09:00:00 PM UTC

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Organization & Contact Information

AgencyNational Aeronautics And Space Administration → NASA Shared Services Center

ContactsNo contacts available

OfficeN/A

Organization / Agency

National Aeronautics And Space Administration → NASA Shared Services Center

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

Fabrication of 12-layer RF PCBs using low-loss microwave substrates (Astra MT77) with strict control over stack-up, trace geometry, via dimensions, and dielectric properties for optimal antenna performance.