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High-Performance Hardware/PCB Design

Active

Federal

Response Deadline10/14/2026, 09:00:00 PM UTC

Contract Overview

Solicitation details, issuing organization, response deadlines, documents, and interested companies for this government contract opportunity.

AI Contract Overview

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This subcontract opportunity with the Department of Defense, specifically the FA8615 Aflcmc Wamk F16 agency, focuses on the design and manufacture of high-performance hardware and printed circuit assemblies. The project supports USAF F-16 Next-Generation Mission Compute initiatives by providing ruggedized circuit boards, processors, and memory modules for prime contractors. The technical requirements involve utilizing SoC and FPGA technologies to ensure all hardware meets MIL-STD-810 aviation environment standards for flight readiness. Interested parties must respond by October 14, 2026, under NAICS code 334418.

General Info

DoD subcontract for F-16 high-performance hardware and circuit assemblies; deadline October 14, 2026.

Agency

Department Of Defense → FA8615 Aflcmc Wamk F16View Agency

NAICS

334418 - Printed Circuit Assembly (Electronic Assembly) ManufacturingView NAICS

Place of Performance

OH

Set-Aside

NONE

Documents

This scope was carved out of FA8615-26-INDUSTRYDAY-F16NGMC.

The full solicitation package (2 documents), including the RFP, is on the prime solicitation, not on this scope.

View the prime solicitation

USAF F-16 Next-Generation Mission Compute (NGMC) Industry Day

AI Contract Breakdown

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Timeline

PostedSep 18

subcontract

Response DeadlineOct 14

Submission deadline

Response Deadline

10/14/2026, 09:00:00 PM UTCin 25 days

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Organization & Contact Information

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AgencyDepartment Of Defense → FA8615 Aflcmc Wamk F16

ContactsNo contacts available

OfficeN/A

Organization / Agency

Department Of Defense → FA8615 Aflcmc Wamk F16

View Agency Profile

Office AddressN/A

ContactsNo contact information available

Full Description

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Designs and manufactures ruggedized circuit boards, processors, and memory modules for prime contractors on USAF F-16 Next-Generation Mission Compute projects. Utilizes SoC and FPGA technologies to meet MIL-STD-810 aviation environment standards. Delivers flight-ready printed circuit assemblies.

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